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YUFFEN
| Product Name | Thermal pad | ||
| Test items | HC300E test value | Unit | Test method |
| Color | White or Customized | Visual | |
| Thickness | 0.3-10.0 | mm | ASTM D374 |
| Density | 1.9±0.2 | g/cc | ASTM D792 |
| Main ingredients | Silicone | ||
| Hardness | 30±5(≤3mm) | Shore C | ASTM D2240 |
| 20±5(>3mm) | |||
| Tensile Strength | >1.0 | N | ASTM D412 |
| Breakdown Resistor | ≥10000 | kv/mm | GB/T1408.1-2006 |
| Volume Resistivity | 8.3*1012 | Ω.cm | GB/T1410-2006 |
| Continous Use Temp | -40~+220 | ℃ | EN344 |
| Weight Damnify | ≤1.0 | % | @200℃ 200H |
| Flame Rating | V0 | UL-94 | |
| Thermal conductivity | 1~12.8 | W/m.k | ASTM 5470 |
Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic. It can fill the gap between heat-generating components and heat sink, metal mechanism and shell or other cooling devices. The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the life-span of equipments.
Characteristic：
Phase Transition，high thermal conductivity，thin thickness, low thermal resistance under low pressure, efficient heat
dissipation，low volatility
| Product Name | Thermal pad | ||
| Test items | HC300E test value | Unit | Test method |
| Color | White or Customized | Visual | |
| Thickness | 0.3-10.0 | mm | ASTM D374 |
| Density | 1.9±0.2 | g/cc | ASTM D792 |
| Main ingredients | Silicone | ||
| Hardness | 30±5(≤3mm) | Shore C | ASTM D2240 |
| 20±5(>3mm) | |||
| Tensile Strength | >1.0 | N | ASTM D412 |
| Breakdown Resistor | ≥10000 | kv/mm | GB/T1408.1-2006 |
| Volume Resistivity | 8.3*1012 | Ω.cm | GB/T1410-2006 |
| Continous Use Temp | -40~+220 | ℃ | EN344 |
| Weight Damnify | ≤1.0 | % | @200℃ 200H |
| Flame Rating | V0 | UL-94 | |
| Thermal conductivity | 1~12.8 | W/m.k | ASTM 5470 |
Conductive Silicon Pad is a kind of thermal interface with high performance. It is soft, self-sticky and elastic. It can fill the gap between heat-generating components and heat sink, metal mechanism and shell or other cooling devices. The heat can be transferred out speedily so as to improve the electronic components' working efficiency and prolong the life-span of equipments.
Characteristic：
Phase Transition，high thermal conductivity，thin thickness, low thermal resistance under low pressure, efficient heat
dissipation，low volatility
