High Temperature Resistance Tear Resistance Cloth Foam Board Red Silicone Sponge Insulation Gasket For Heat Transfer Machine from China manufacturer

The GAP series gap-filling material is a low modulus (soft) and highly thermally conductive silicone rubber material used to fill large irregular gaps between the semiconductor component and the heat dissipating surface, eliminating the thermal resistance generated by air in order to facilitate the heat dissipation. The thermal gap material has good softness (compressibility) and can fill the variable gap between multiple components and the universal heat sink, while only causing extremely low pressure on the components. The surface of the thermal pad has good tackiness and minimizes the thermal contact resistance between the component and the heat sink.

PRODUCT PARAMETER
Name	Rogers Silicone -BISCO® Series - Silicone Foam
Color	Grey, Black
Size and Stiffiness	Custom any size based on your usage
MOQ	1 pc
Fireproofing	94V0
Surface Impedance	≤0.05Ω/inch
Model series products	1 ： Rogers BISCO® Silicone BF-2000- Super Soft Silicone Foam 2： Rogers BISCO® Silicone HT-870- Soft Silicone Foam 3： Rogers BISCO® Silicone HT-800-Medium Hardness Silicone Foam 4：Rogers BISCO® Silicone HT-820-Hard Silicone Foam 5：Rogers BISCO® Silicone HT-840- Extremely Hard Silicone Foam
Heat Resistant Temperature	-55℃-220℃
Adhesion Strength	≥1.3kg/25mm
Volume resistivity, Ohm-cm	ASTM D 257
Dielectric Strength	ASTM D149Volts/mil

Crafted using premium-quality raw materials sourced from internationally acclaimed brands such as Electric Chemicals, Dow Corning, and Shin-Etsu of Japan, our sheets guarantee superior durability and reliability. Moreover, these Thermal Conductive Silicone Sheets have successfully passed rigorous UL certification and adhere to international safety regulations such as ROHS, REACH, and UL, offering eco-friendliness and utmost safety.

Broadly applied across various sectors, including smart terminals, LED lighting, power modules, communication devices, new energy vehicle components, and wearable technology, they are particularly well-suited for thermal management solutions in printed circuit boards (PCBs), LED chips, and diverse electronic devices. With a strong focus on customization, we tailor our silicone sheets to your specific dimensions and requirements, catering to individual needs in different application scenarios.

GAP series thermal conductive gaskets cover products with thermal conductivity of 1-6W/m.k. They can be customized to meet customer needs in shape, specification, size and color. In addition, the thermal conductivity of GAP060 can be up to 6W/m.k and can be compressed under high pressure. It has good dielectric strength and can be easily compressed under low pressure. It can provide excellent thermal conductivity.