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YUFFEN
The following parameters are for reference only | ||||
Thickness | 0.025mm-0.125mm or customized | |||
Width | 500mm/1020mmor customized | |||
Length | 33mor customized | |||
Color | brown | |||
Backing | silicone | |||
Application temperature | 260℃--280℃ | |||
Adhesion To Steel(N/25mm) | 2.5-10(N/25mm) | |||
Tensile Strength(kg/25mm) | 10-20(N/25mm) | |||
Usage | Masking circuit boards, soldering ,electrical insulation and splicing wires，FPC soldering, PCB high temperature painting shielding, insulation for motor coil and capacitor. | |||
Feature
High temperature: Heat resistant tape is suitable for a wide temperature range of 300℃（572℉）. Hot press belt has good protective effect on electronic products, motors, solder, paint, packaging and fixing, printed circuit board, etc.. Strong silicone protection: the hot tropics are made of polyimide film and silicone. Superior heat resistance and strong silicone adhesive, so that easy to adhere to the heat transfer belt, no residue after peeling.
The following parameters are for reference only | ||||
Thickness | 0.025mm-0.125mm or customized | |||
Width | 500mm/1020mmor customized | |||
Length | 33mor customized | |||
Color | brown | |||
Backing | silicone | |||
Application temperature | 260℃--280℃ | |||
Adhesion To Steel(N/25mm) | 2.5-10(N/25mm) | |||
Tensile Strength(kg/25mm) | 10-20(N/25mm) | |||
Usage | Masking circuit boards, soldering ,electrical insulation and splicing wires，FPC soldering, PCB high temperature painting shielding, insulation for motor coil and capacitor. | |||
Feature
High temperature: Heat resistant tape is suitable for a wide temperature range of 300℃（572℉）. Hot press belt has good protective effect on electronic products, motors, solder, paint, packaging and fixing, printed circuit board, etc.. Strong silicone protection: the hot tropics are made of polyimide film and silicone. Superior heat resistance and strong silicone adhesive, so that easy to adhere to the heat transfer belt, no residue after peeling.
Automotive sensor and manifolds; Insulating circuit boards; Etching; Fiber Optics Cable; High temperature powder coating; Semiconductor manufacturing; Wave soldering during circuit board assembly; 3D Printing.